GD32E103R8T6
Packaging specification: LQFP.
Installation type: surface mount type.
Application field: Robotics.
Kernel specification: 8-bit.
Packaging method: woven tape/tray/tube packaging.
Installation type: surface mount type.
Application field: Robotics.
Kernel specification: 8-bit.
Packaging method: woven tape/tray/tube packaging.
4.9
★ ★ ★ ★ ★
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4 star 0 (0%)
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Reviews
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Score Excellent
★ ★ ★ ★ ★ 16/08/2024
Good service!
(156)
★ ★ ★ ★ ★ 23/07/2024
Good!
(982)
★ ★ ★ ★ ★ 23/07/2024
Good quality!
(982)